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PERFORMANCE TEST

TEST METHOD

1% TOL.

5% TOL.
 Temperature Coefficient MIL-STD-202F, method 304  -55C to + 125C

by Type
 Thermal Shock

MIL-STD-202F, method 107  5 cycles, -55C to + 125C(step by step 2minutes)

 + - (0.5%+0.05ohm) + - (1%+0.05ohm)
 Low Temperature Operation

MIL-R-55342D, Para.4.7.4    one hour at -65C followed by 45 minutes    RCWV         

+ - (0.5%+0.05ohm) + - (1%+0.05ohm)
 Short Time Overload MIL-R-55342D, Para.4.7.5 2.5times RCWVfor 5 seconds + - (1%+0.05ohm) + - (2%+0.05ohm)
 Insulation Resistance MIL-STD-202F, method 302 RCOV for 1 minute

>10gohm
 Dielectric Withstand Voltage MIL-STD-202F, method 301 R.M.S.for 1 minute

by Type
 Resistance to Soldering Heat MIL-STD0202F, method 210C soldered to test board at 260C for 10 seconds + - (0.5%+0.05ohm) + - (1%+0.05ohm)
 Moisture Resistance MIL-STD-202F, method 106F 42 cycles, total 1000 hours + - (0.5%+0.05ohm) + - (2%+0.05ohm)
 Life MIL-STD-202F, method 108A 1000 hours at 70C RCWV intermittent + - (1%+0.05ohm) + - (3%+0.05ohm)
 Solderability MIL-STD-202F, Method 208G 230C for 5 seconds

>95% Coverage
 Bending Strength JIS-C-5202, para.6.1.4,unit mounted in center of 90mm board length, deflected 5mm(power chip 2mm)in either direction for 5 seconds + - (1%+0.05ohm) + - (1%+0.05ohm)

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